If I learned anything from my internship with Unitech Composites, it is that surface preparation is essential in all operations of composite layup and assembly. This is true for bonding as well. Surface preparations, although tedious and seemingly unimportant, are key in establishing properties that their subsequent specifications claim. To ensure that an epoxy resin can perform at a specified temperature range for a long time, adherence to the following procedure is required.

This procedure is specifically written for the application of Vishay’s M-bond 43-B, 600, and 610 adhesives in bonding strain gauges to a composite surface. These adhesive systems are a product of Vishay … » More …

We use indium wire for creating cryogenic seals in the HYPER lab. We buy most of our wire from Indium Wire Extrusion (IWE). Indium is expensive, however, quoted by IWE at $180/oz. Rather than selling the wire back for half its original price, we like to recycle our indium by melting it down and re-extruding it into usable indium wire. Indium’s low melting point of 156.6 °C (313.9 °F) and softness (Mohs hardness 1.2) make this process cheap and easy. We have the capability of extruding 0.0625 inch (1.5875 mm) and 0.1 inch (2.54 mm) diameter indium wire with the … » More …